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US 10,946,494 B2Granted
Polishing agent, stock solution for polishing agent, and polishing method
AssigneeShowa Denko Materials Co., Ltd.
InventorsMasayuki Hanano, Masaya Nishiyama, Yutaka Goh, Haruaki Sakurai, Tomohiro Iwano
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Abstract
A polishing agent for polishing a resin comprises abrasive grains, a water-soluble polymer having an ether bond, an organic solvent and water, wherein the abrasive grains have a positive charge in the polishing agent and an average particle diameter of the abrasive grains is larger than 20 nm.
Claims19
A polishing agent, comprising:abrasive grains;
- a water-soluble polymer comprising an α-glucose polymer;
- an organic solvent;
- and water, wherein the abrasive grains have a positive charge in the polishing agent, and an average particle diameter of the abrasive grains is larger than 20 nm, and pH of the polishing agent is 1.0 or more and less than 3.0.
Dependencies are inferred from the claim text.