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US 10,946,483 B2Granted
Laser apparatus and method of dicing a substrate using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYoung-Chul Kwon, Man-Hee Han
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Abstract
A laser apparatus may include a spectrum controller and a spectrum modulator. The spectrum controller may control a center wavelength and/or a bandwidth of a spectrum of a laser beam. The spectrum modulator may modulate the spectrum of the laser beam having the center wavelength and/or the bandwidth controlled by the spectrum controller. Thus, the laser beam may have the spectrum optimal for a semiconductor fabrication process. Particularly, the substrate may be accurately diced using the laser beam having the optimal spectrum.
Claims4
A method of dicing a substrate, the method comprising:
- controlling at least one of a center wavelength and a bandwidth of a spectrum of a laser beam;
- modulating the spectrum of the laser beam, and
- focusing the laser beam, which has the spectrum having the at least one of the center wavelength and the bandwidth controlled by a spectrum controller, on the substrate,
- wherein the controlling the center wavelength comprises:
- dispersing the laser beam toward a control plate having a slit using a first prism;
- providing the dispersed laser beam with a directionality substantially perpendicular to a surface of the control plate using a second prism;
- and
- passing the dispersed laser beam through the slit with changing positions of the control plate.
5 more elements
Dependencies are inferred from the claim text.