Cooling systems comprising fluid diodes with variable diodicity for two-phase flow control

A cooling system comprising:

• a heat generating electronic device thermally coupled to a microchannel two-phase cooling apparatus, the microchannel two-phase cooling apparatus comprising:
• a cooling manifold comprising one or more fluid inlets, one or more fluid outlets, and a plurality of heat sink fluid channels extending between and fluidly coupling the one or more fluid inlets and the one or more fluid outlets;
• and
• a fluid diode array comprising a plurality of fluid diodes positioned within the cooling manifold, wherein:
• individual fluid diodes of the fluid diode array are fluidly coupled to channel inlets of individual heat sink fluid channels of the plurality of heat sink fluid channels;
• the fluid diode array comprises a first set of fluid diodes comprising a first average diodicity, and a second set of fluid diodes comprising a second average diodicity;
• and
• the first average diodicity is greater than the second average diodicity and each individual fluid diode of the first set of fluid diodes has a greater diodicity than any individual fluid diode of the second set of fluid diodes.

A method of cooling a heat generating electronic device, the method comprising:

• pumping a cooling fluid through a cooling manifold of a microchannel two-phase cooling apparatus thermally coupled to the heat generating electronic device using a pump fluidly coupled to the cooling manifold, thereby removing heat from the heat generating electronic device and storing energy of the removed heat in latent heat of the cooling fluid, wherein:
• the cooling manifold comprises one or more fluid inlets, one or more fluid outlets, and a plurality of heat sink fluid channels extending between and fluidly coupling the one or more fluid inlets and the one or more fluid outlets;
• and
• the microchannel two-phase cooling apparatus further comprises a fluid diode array comprising a plurality of fluid diodes positioned within the cooling manifold, wherein:
• individual fluid diodes of the fluid diode array are fluidly coupled to channel inlets of individual heat sink fluid channels of the plurality of heat sink fluid channels;
• the fluid diode array comprises a first set of fluid diodes comprising a first average diodicity and a second set of fluid diodes comprising a second average diodicity;
• and
• the first average diodicity is greater than the second average diodicity and each individual fluid diode of the first set of fluid diodes has a greater diodicity than any individual fluid diode of the second set of fluid diodes.