Mechanism with folded wrapping to seal components immersed in coolant

A method, comprising:

• adhering a first end of a mechanism with folded wrapping to a motherboard to form a seal with the motherboard;
• adhering a second end of the mechanism with the folded wrapping to an edge of a heatsink to form a seal with the edge of the heatsink;
• wherein the mechanism with the folded wrapping is to enclose and seal a volume between the motherboard and the heatsink where the volume includes one or more processors;
• and
• wherein the mechanism with the folded wrapping prevents coolant from reaching the one or more processors.

A system, comprising:

• a circuit board;
• a heatsink;
• and
• a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink;
• wherein the mechanism with the folded wrapping is dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink;
• and
• wherein on enclosing and sealing the volume, the mechanism with the folded wrapping prevents coolant from reaching the one or more processors.

An apparatus, comprising:

• means for adhering a first end of a mechanism with folded wrapping to a motherboard to form a seal with the motherboard;
• means for adhering a second end of the mechanism with the folded wrapping to an edge of a heatsink to form a seal with the edge of the heatsink;
• wherein the mechanism with the folded wrapping is to enclose and seal a volume between the motherboard and the heatsink where the volume includes one or more processors;
• and
• wherein the mechanism with the folded wrapping prevents coolant from reaching the one or more processors.