Thermal management assemblies having cooling channels within electrically insulated posts for cooling electronic assemblies

An electronic assembly comprising:

• a printed circuit board having a first surface and a second surface opposite to the first surface;
• one or more switching semiconductor devices disposed on the first surface;
• one or more gate drive devices disposed on the second surface;
• and
• a thermal management assembly thermally connected to the printed circuit board, the thermal management assembly comprising:
• a heatsink;
• a heatsink manifold formed through the heatsink, the heatsink manifold having a fluid inlet and a fluid outlet;
• a thermal compensation base layer coupled to the heatsink and configured to thermally connect the heatsink and the one or more switching semiconductor devices;
• a cooling manifold disposed through the printed circuit board to form a fluid flow path through the printed circuit board;
• and
• two or more electrically insulated posts disposed between the heatsink manifold and the cooling manifold and having a vertical cooling channel through individual electrically insulated posts, wherein at least one electrically insulated post fluidly connects the fluid inlet to the cooling manifold to form an upward fluid path and at least one electrically insulated post fluidly connects the cooling manifold to the fluid outlet to form a downward fluid path.