Substrate assembly and method of bonding substrates
AssigneeTaiwan Green Point Enterprises Co., Ltd.
InventorsSung-Yi Yang, Pao-Chuan Wang
Life of this patent
Estimating the term…
Abstract
A substrate assembly and a method of bonding substrates are disclosed. The method includes steps of: providing two substrate; subjecting a connecting surface of each of the substrates to surface-modifying treatment to form surface-modified region respectively on each of the connecting surfaces; contacting the substrates in such a manner that the substrates are connected with each other through a physical interaction between the surface-modified regions; and laser irradiating and melting a portion of each of the connecting surfaces to form a respective bonding region, and solidifying the melted bonding regions of the substrates to bond the substrates together.
Claims12
A method of bonding substrates, comprising steps of:
- providing a first substrate and a second substrate;
- subjecting a first connecting surface of the first substrate and a second connecting surface of the second substrate to a surface-modifying treatment using an energy source, so as to form a first surface-modified region on the first connecting surface and a second surface-modified region on the second connecting surface;
- contacting the first and second substrates in such a manner that the first and second substrates are connected with each other through a physical interaction between the first surface-modified region and the second surface-modified region;
- and
- irradiating a portion of the first connecting surface of the first substrate and a portion of the second connecting surface of the second substrate that are close to, but are spaced apart from peripheral regions of the first and second connecting surfaces using a laser, such that the portions of the first and second connecting surfaces are melted to form first and second bonding regions, respectively;
- and
- cutting the peripheral regions of the first and second connecting surfaces that are not melt-bonded from the first and second substrates, respectively, using the laser, and then solidifying the melted first and second bonding regions so as to bond the first and second substrates together.
A substrate assembly, comprising:
- a first substrate including a first bonding region and a first surface-modified region;
- and
- a second substrate including a second bonding region and a second surface-modified region,
- wherein said first and second substrates are bonded together through a physical interaction of said first surface-modified region and said second surface-modified region and melt-bonding between said first bonding region and said second bonding region, and
- wherein said first and second bonding regions are respectively at laser-cut peripheries of said first and second substrates, and respectively surround and enclose said first and second surface-modified regions.
Dependencies are inferred from the claim text.