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US 10,938,128 B2Granted
Superconducting interconnects with ultra-low thermal conductivity
AssigneeBrookhaven Technology Group, Inc.
InventorVyacheslav Solovyov
Life of this patent
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Abstract
Superconducting interconnects with ultra-low thermal conductivity capable of providing a direct connection between a millikelvin temperature environment and a 70 K temperature environment.
Claims19
Superconducting interconnects with ultra-low thermal conductivity, comprising:
- a first ultra-low thermal conductivity substrate;
- a plurality of discreet high temperature superconducting lines bonded to said first substrate with an adhesive;
- a high temperature superconducting layer having first and second sides, said first side of said high temperature superconducting layer positioned to face said superconducting lines;
- a second ultra-low thermal conductivity substrate bonded to said second side of said high temperature superconducting layer;
- and
- a dielectric positioned between and separating said discreet high temperature superconducting lines from said high temperature superconducting layer.
3 more elements
A method of manufacturing superconducting interconnects with ultra-low thermal conductivity, comprising:
- providing a first ultra-low thermal conductivity substrate;
- bonding a first high temperature superconducting layer to said first substrate;
- etching a plurality of discreet transmission lines within said first high temperature superconducting layer along the length thereof;
- applying a dielectric coating to cover said discrete transmission lines;
- providing a second ultra-low thermal conductivity substrate having a second high temperature superconducting layer bonded thereto;
- and
- joining said first and second substrates such that said second high temperature superconducting layer is positioned adjacent said dielectric coating.
4 more elements
Dependencies are inferred from the claim text.