Nanosheet eDRAM
AssigneeInternational Business Machines Corporation
InventorsAlexander Reznicek, Muthumanickam Sankarapandian, Donald F. Canaperi, Keith E. Fogel
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Abstract
A semiconductor structure is provided in which a nanosheet device is formed laterally adjacent, but in proximity to, an embedded dynamic random access memory (eDRAM) cell. The eDRAM cell and the nanosheet device are connected by a doped polycrystalline semiconductor material that is formed during the epitaxial growth of doped single crystalline semiconductor source/drain regions of the nanosheet device. An eDRAM cut mask is used to remove unwanted semiconductor material from regions not including the eDRAM cell and the nanosheet device.
Claims10
A semiconductor structure comprising:
- a nanosheet device comprising a plurality of stacked and suspended semiconductor channel material nanosheets located above a topmost semiconductor layer of a semiconductor-on-insulator (SOI) substrate, a functional gate structure surrounding a portion of each semiconductor channel material nanosheet of the plurality of stacked and suspended semiconductor channel material nanosheets, and a source/drain (S/D) region composed of a doped single crystalline semiconductor material located on each side of the functional gate structure and physically contacting sidewalls of each semiconductor channel material nanosheet of the plurality of stacked and suspended semiconductor channel material nanosheets;
- an embedded dynamic access memory (eDRAM) cell located laterally adjacent to the nanosheet device and located in a trench that is present in the SOI substrate;
- a strap composed of a doped polycrystalline semiconductor material connecting a polycrystalline semiconductor material electrode of the eDRAM cell to one of the S/D regions of the nanosheet device;
- and
- a collar dielectric material located entirely above a topmost surface of the polycrystalline semiconductor material electrode and on sidewalls of an upper portion of the trench, wherein the strap directly contacts a topmost surface of the collar dielectric material, a topmost surface of the polycrystalline semiconductor material electrode, an entirety of a sidewall of the collar dielectric material, and an entirety of a sidewall of the one of the S/D regions that the strap is connected to.
Dependencies are inferred from the claim text.