Fan-out transition structure for transmission of mm-Wave signals from IC to PCB via chip-scale packaging

A mm-Wave communication structure, comprising:

• a first transmission structure, wherein the first transmission structure employs a first ring transition structure followed by a first ground structure and a second ground structure configured to carry a ground signal, wherein:
• the first ring transition structure employs an outer ring and an inner ring,
• the first ground structure is discontinuous before second ground structure;
• a second transmission structure, wherein the second transmission structure employs a second ring transition structure followed by a third ground structure and a fourth ground structure configured to carry the ground signal, wherein the second ring transition structure employs an outer ring and an inner ring;
• a third transmission structure configured to carry a millimetre wave signal, wherein the third transmission structure begins at the center of the first ring transition structure and the second ring transition structure and the third transmission structure is coplanar with the second transmission structure;
• and
• a fourth transmission structure configured to operatively couple an integrated circuit (IC) and the first transmission layer, the second transmission layer, and the third transmission structure.