Carrier plate removing method
AssigneeDisco Corporation
InventorsKatsuhiko Suzuki, Takatoshi Sakurai, Hayato Kiuchi
Life of this patent
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Abstract
A carrier plate removing method for removing a carrier plate from a workpiece previously provided through a temporary bonding layer on the front side of the carrier plate is provided. The carrier plate removing method includes a shoulder portion forming step of processing a peripheral portion of the carrier plate along a peripheral edge thereof from the front side of the carrier plate on which the workpiece is provided, thereby forming a shoulder portion as a lower part connected to the back side of the carrier plate, the lower part projecting horizontally outward from the side surface of an upper part connected to the front side of the carrier plate.
Claims17
A carrier plate removing method for removing a carrier plate from a workpiece, said carrier plate having a front side and a back side opposite to said front side, said workpiece being previously provided through a temporary bonding layer on the front side of said carrier plate, said carrier plate removing method comprising:
- forming a shoulder portion as a lower part connected to the back side of said carrier plate, said lower part projecting horizontally outward from a side surface of an upper part connected to the front side of said carrier plate;
- a holding step of holding said workpiece by using a holding unit from an upper side of said workpiece in the condition where said workpiece is positioned above said carrier plate, after performing said shoulder portion forming step;
- and
- a carrier plate removing step of applying a downward force from a push member to said shoulder portion after performing said holding step, thereby moving said carrier plate away from said workpiece to thereby remove said carrier plate from said workpiece.
Dependencies are inferred from the claim text.