Implantable medical instrument preform, implantable medical instrument and preparation method thereof

A method of preparing an implantable medical device, comprising:

• providing a metal basal body in a chamber, the metal basal body having a metallic element that is selected from a group consisting of cobalt, chromium, iron, nickel, molybdenum, titanium, platinum and tantalum;
• conducting plasma cleaning for the metal basal body for 5-60 minutes;
• depositing an amorphous carbon transitional body on the surface of a metal basal body via a chemical vapor deposition method where a methane gas is pumped into the chamber at a flow of 10-50 sccm, while the vacuum pressure in the chamber is maintained to be below 10.0 Pa, the radio frequency power is regulated to be 200 W-1000 W, and the bias voltage to be 10 V-500 V, and wherein the deposition is conducted for 1-60 minutes, and wherein the amorphous carbon transitional body covers part of the surface of the metal basal body in a manner that exposes part of the metal basal body, and has a thickness of 1-100 nm;
• wherein during the depositing step, increasing the amount of plasma by mixing an auxiliary argon gas while methane is pumped into the chamber, wherein the flow of argon is 50-200 sccm;
• covering the transitional body and the surface of the metal basal body with a polymer film layer via a radio frequency plasma enhanced chemical vapor deposition (RF-PECVD) method by pumping argon into the chamber at a flow of 10-100 sccm while the atmosphere pressure in the chamber is controlled to be 2-7 Pa, the power of the radio frequency power source is regulated to be 20 W-200 W, and the bias voltage to be 10 V-200 V, and the deposition is conducted for 10-60 minutes;
• wherein the polymer film layer is selected from a group consisting of polyethylene glycol, polyethylene diether, crown ether, polyvinyl alcohol, polyvinyl ether, polyethylene oxide, polyethylene oxide alcohol, polyethylene oxide ether;
• and
• wherein the polymer film layer prevents endothelium growth and covering, and the transitional body connects the metal basal body and the polymer film layer.