Removal method of carrier plate
AssigneeDisco Corporation
InventorKatsuhiko Suzuki
Life of this patent
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Abstract
There is provided a removal method of a carrier plate used when the carrier plate is removed from a workpiece bonded to a region excluding an outer rim part in a front surface of the carrier plate by a temporary bonding layer disposed on the whole of the front surface of the carrier plate. This removal method of a carrier plate includes a temporary bonding layer removal step of removing part or all of an outer rim part of the temporary bonding layer, a holding step of holding the workpiece from the upper side by a holding unit after removing part or all of the outer rim part of the temporary bonding layer, and a carrier plate removal step of removing the carrier plate from the workpiece by applying a downward force to the outer rim part of the carrier plate from the side of the front surface.
Claims14
A removal method of a carrier plate used when the carrier plate is removed from a workpiece bonded to a region excluding an outer rim part in a front surface of the carrier plate by a temporary bonding layer disposed on a whole of the front surface of the carrier plate, the removal method comprising:
- a temporary bonding layer removal step of removing part or all of an outer rim part of the temporary bonding layer;
- a holding step of holding the workpiece from an upper side by a holding unit after removing part or all of the outer rim part of the temporary bonding layer;
- and
- a carrier plate removal step of removing the carrier plate from the workpiece by applying a downward force to the outer rim part of the carrier plate from a side of the front surface of the carrier plate by a push component and moving the carrier plate in such a direction as to get further away from the workpiece in a state that the workpiece is held from the upper side.
Dependencies are inferred from the claim text.