Near-infrared absorbing white material and preparation method thereof
AssigneeBuseong Polycom Co., Ltd.
InventorsGu-won Seo, Dae-sung Yu, Bo-kyung Kim
Life of this patent
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Abstract
A near-infrared-absorption white material, a method of manufacturing the same, and uses thereof. The near-infrared-absorption material includes copper pyrophosphate compound. The copper pyrophosphate compound has a brightness (CIE L*) value of 90 or more in a visible-ray region and is excellent in particle manufacturing properties, and a crystalline structure of the copper pyrophosphate compound is made chemically stable using a heat treatment at a high temperature. The copper pyrophosphate compound is represented by the following chemical formula: Cu2P2O7 or Cu2P2O7.XH2O (x=1-3).
Claims10
A near-infrared-absorption white material, comprising:
- a copper pyrophosphate compound;
- wherein
- a brightness of the copper pyrophosphate compound is at least 90 in a visible-ray region;
- the copper pyrophosphate compound comprises a crystalline structure, the crystalline structure is made chemically stable using a heat treatment in a temperature range of 750 to 849° C.;
- the copper pyrophosphate compound has a particle size of 1 μm;
- and
- the copper pyrophosphate compound is represented by the following chemical formula:
- Cu2P2O7 or Cu2P2O7.XH2O (x=1-3).
A method of manufacturing a near-infrared-absorption white material, the method comprising:
- manufacturing a supersaturated aqueous solution of a divalent copper compound and a metal pyrophosphate,
- performing a reaction on the supersaturated aqueous solution at a temperature of 30° C. to 90° C. using a wet synthesis method;
- wherein the near-infrared-absorption white material comprises a copper pyrophosphate compound;
- a brightness of the copper pyrophosphate compound is equal to or more than 90 in a visible-ray region;
- the copper pyrophosphate compound comprises a crystalline structure, the crystalline structure is made chemically stable using a heat treatment at a temperature of 750 to 849° C.;
- the copper pyrophosphate compound has a particle size of 1 μm;
- and the copper pyrophosphate compound is represented by the following chemical formula:
- Cu2P2O7 or Cu2P2O7.XH2O (x=1-3).
Dependencies are inferred from the claim text.