Substrate routing and throughput modeling
AssigneeApplied Materials, Inc.
InventorShyam Sunder Emani
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AssigneeApplied Materials, Inc.
InventorShyam Sunder Emani
Estimating the term…
Embodiments disclosed herein generally relate to methods, systems, and non-transitory computer readable medium for scheduling a substrate processing sequence in an integrated substrate processing system. A client device assigns a processing sequence to each substrate in a batch of substrates to be processed. The client device assigns a processing chamber to each process in the process sequence for each processing chamber in the integrate substrate processing system. The client device generates a processing model for the batch of substrates. The processing model defines a start time for each substrate in each processing chamber. The client device generates a timetable for the batch of semiconductor substrates based off the processing model. The client device processes the batch of substrates in accordance with the timetable.
A method of routing a semiconductor substrate for processing in an integrated substrate processing system, comprising:
A system, comprising:
A non-transitory computer readable medium having instructions stored thereon, which, when executed by a processor, cause the processor to perform a method of scheduling a semiconductor substrate processing sequence in an integrated substrate processing system, comprising:
Dependencies are inferred from the claim text.