Aluminum-silicon-carbide composite and method of manufacturing same
AssigneeDenka Company Limited
InventorsAkimasa Yuasa, Takeshi Miyakawa, Daisuke Goto
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Abstract
Provided are an aluminum-silicon-carbide composite having high thermal conductivity, low thermal expansion, and low specific gravity and a method for producing the composite. Provided is an aluminum-silicon-carbide composite formed by impregnating a porous silicon carbide molded body with an aluminum alloy. The ratio of silicon carbide in the composite is 60 vol % or more, and the composite contains 60-75 mass % of silicon carbide having a particle diameter of 80 μm or more and 800 μm or less, 20-30 mass % of silicon carbide having a particle diameter of 8 μm or more and less than 80 μm, and 5-10 mass % of silicon carbide having a particle diameter of less than 8 μm.
Claims4
An aluminum-silicon-carbide composite formed by impregnating a porous silicon carbide molded body with an aluminum alloy, wherein
- a ratio of the silicon carbide in the composite is 60 vol % or more;
- and
- the composite contains:
- 60-75 mass % of silicon carbide having a particle diameter of 80 μm or more and 800 μm or less;
- 20-30 mass % of silicon carbide having a particle diameter of 8 μm or more and less than 80 μm;
- and
- 5-10 mass % of silicon carbide having a particle diameter of less than 8 μm,
- wherein the aluminum-silicon-carbide composite has a thermal conductivity of 230 W/mK or more at 25° C.
Dependencies are inferred from the claim text.