Insert molded product, electrical signal connector, endoscope, and insert molding method
AssigneeOlympus Corporation
InventorsTetsuya Endo, Naohito Shiga, Kohei Shiramizu, Junko Nakamoto
Life of this patent
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Abstract
An insert molded product in which a metal base member and a resin are bonded together includes a ground layer; a noble metal layer formed of a noble metal; a compound layer formed of a compound containing silicon (Si) and oxygen (O); and a mixture layer where the compound and the resin are mixed together, wherein the ground layer, the noble metal layer, the compound layer, and the mixture layer are formed in this order on the metal base member, and wherein nickel (Ni) is included in both the compound layer and the mixture layer.
Claims15
An insert molded product in which a metal base member and a resin are bonded together, comprising:
- the metal base member;
- a ground layer;
- a noble metal layer formed of a noble metal;
- a compound layer comprising a porous silica film;
- and
- a mixture layer where material of the compound layer and the resin are mixed together;
- and
- the resin,
- wherein the ground layer, the noble metal layer, the compound layer, and the mixture layer are formed in this order on the metal base member, and
- wherein nickel (Ni) is included in both the compound layer and the mixture layer.
An insert molding method for bonding a metal base member and a resin, comprising:
- a process of forming a ground layer on a surface of the metal base member;
- a process of forming a noble metal layer with a thickness equal to or less than 0.5 micrometers on a surface of the ground layer;
- a process of forming a layer of a compound with a thickness equal to or less than 10 micrometers on a surface of the noble metal layer, the compound containing silicon (Si) and oxygen (O) in order to form a porous silica film;
- and
- a process of introducing the resin with a temperature equal to or more than 200 degree Celsius by insert molding so that the introduced resin is in contact with the compound layer resulting in a mixture layer where material of the compound layer and the resin are mixed together and resulting in nickel (Ni) included in both the compound layer and the mixture layer.
Dependencies are inferred from the claim text.