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US 10,916,878 B2Granted
Unitary molded USB device
AssigneeWestern Digital Technologies, Inc.
InventorsTee Khoon Guan, Pradeep Kumar Rai
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Abstract
A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.
Claims18
A USB device, including:
- a semiconductor device;
- a housing flowed around a top and bottom of the semiconductor device to affix the semiconductor device within the USB device and to enclose the semiconductor device within the USB device, the housing comprising a space above the semiconductor device configured to allow insertion of the USB device into a USB device host slot.
A USB device, including:
- a semiconductor device comprising a plurality of connector pins;
- a housing injection molded around the semiconductor device, the housing engaging the semiconductor device at a plurality of points comprising lip and a back wall such that the semiconductor device is fixed within the housing, the housing comprising a space above the plurality of connector pins, the space configured to allow insertion of the USB device into a USB device host slot;
- wherein the back wall is further configured to be gripped for inserting the USB device into the USB device host slot and for removing the USB device from the USB device host slot.
A method of fabricating USB devices, comprising:
- (a) placing a plurality of semiconductor devices in a mold;
- (b) encasing a top and bottom of the plurality of semiconductor devices in a molten molding compound, the molten molding compound injected around the top and bottom of the plurality of semiconductor devices with a space above each of the plurality of semiconductor devices;
- (c) curing the molten molding compound around the plurality of semiconductor devices;
- and
- (d) separating the encased plurality of semiconductor devices into individual USB devices.
2 more elements
A USB device, including:
- a semiconductor device means for storing data;
- housing means for flowing around a top and bottom of the semiconductor device to affix and encase the semiconductor device within the housing means, the housing means comprising a space above the semiconductor device configured to allow insertion of the USB device into a USB device host slot.
Dependencies are inferred from the claim text.