Photonic chip/optical device for aligning and connecting an optical fiber and a photonic integrated waveguide and method of its production

A photonic chip comprising a connecting means for aligning and connecting an optical fiber to a photonic integrated waveguide provided on the photonic chip,

• (a) wherein the photonic chip at least comprises a substrate and a waveguide layer, which is provided on or within an upper portion of the substrate and which defines the photonic integrated waveguide,
• (b) wherein the photonic integrated waveguide and the optical fiber each have a front end portion, each front end portion having an optical axis and a front surface,
• (c) wherein the connecting means comprises a groove configured to receive the front end portion of the optical fiber, in such a way that front surfaces of the photonic integrated waveguide and the optical fiber are positioned opposite each other and that the optical axes of the photonic integrated waveguide and the optical fiber are essentially aligned with each other, and
• (d) wherein the groove is essentially U-shaped in its cross section, the groove has a bottom surface and two inner side surfaces, and at least one of the two inner side surfaces of the U-shaped groove has a coating of an elastic material configured to hold in place the optical fiber after it is inserted into the groove, wherein the thickness of the layers of the photonic chip and depth of the groove are chosen such that the bottom surface of the groove is formed by the material of the substrate, and wherein at least a portion of the optical fiber inserted into the groove physically and directly contacts the bottom surface of the groove formed by the material of the substrate without other material between said portion of the optical fiber and the material of the substrate.