Epoxy resin, epoxy resin composition, cured product and electrical or electronic component
AssigneeMitsubishi Chemical Corporation
InventorKazumasa Oota
Life of this patent
Estimating the term…
Abstract
The present invention relates to a tetramethylbiphenol epoxy resin represented by the following formula (1), which is an epoxy resin having excellent solvent solubility, a small hydrolyzable chlorine amount and further an appropriate melt viscosity and being effectively applicable, to a semiconductor sealing material and electrical or electronic components such as laminate sheet: wherein n represents an integer of 0 to 10.
Claims9
An epoxy resin represented by the following formula (1), having a number average molecular weight (Mn) of 270 to 460, a weight average molecular weight (Mw) of 418 to 2,675, an epoxy equivalent from 196 to 255 g/eq, and a content of hydrolysable chlorine of 90 ppm or less relative to the epoxy resin:
- wherein, n represents an integer of 0 to 10.
Dependencies are inferred from the claim text.