Resistance welding a porous metal layer to a metal substrate utilizing an intermediate element

A method of manufacturing an orthopedic prosthesis comprising the steps of:

• providing the orthopedic prosthesis having an outer porous metal layer and an inner titanium-containing substrate with the porous metal layer positioned against the titanium-containing substrate at an interface therebetween;
• providing an electrode;
• providing an intermediate member positioned between and in contact with the electrode and the porous metal layer, wherein the intermediate member comprises a distinct member from the electrode and the orthopedic prosthesis and is formed separately from the electrode and the orthopedic prosthesis, wherein the intermediate member includes tantalum in contact with tantalum of the porous metal layer, and wherein the intermediate member has a surface configured to interface with and match a contour of an outer surface of the porous metal layer;
• and
• directing an electrical current to the interface between the porous metal layer and the titanium-containing substrate to bond the porous metal layer to the titanium-containing substrate.

A method of manufacturing an orthopedic prosthesis comprising the steps of:

• providing the orthopedic prosthesis having an outer porous metal layer and an inner metal substrate with the porous metal layer positioned against the metal substrate at an interface therebetween;
• providing an electrode;
• providing an intermediate element positioned between and in contact with the electrode and the porous metal layer, wherein the intermediate element comprises a distinct member from the electrode and the orthopedic prosthesis and is formed separately from the electrode and the orthopedic prosthesis, wherein the intermediate member includes tantalum in contact with tantalum of the porous metal layer and includes a copper-containing substrate, and wherein the tantalum of the intermediate element comprises a coating adhered over the copper-containing substrate to limit transfer of the copper-containing substrate to the porous metal layer, and wherein the intermediate element is configured to provide a uniform pressure distribution to the porous metal layer, preserves a porous outer surface of the porous metal layer, and controls material transfer to the metal substrate from one of the intermediate member or electrode;
• and
• directing an electrical current to the interface between the porous metal layer and the metal substrate to bond the porous metal layer to the metal substrate.