Printed circuit board
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPei-Haw Tsao, Tsung-Hsing Lu, Li-Huan Chu
Life of this patent
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Abstract
Generally, the present disclosure provides example embodiments relating to a printed circuit board (PCB). In an embodiment, a structure includes a PCB including insulating layers with respective metal layers being disposed therebetween. Each of first layers of the insulating layers includes a first fiberglass content. A second layer of the insulating layers has a second fiberglass content less than the first fiberglass content. For example, in some embodiments, the second insulating layer does not include a fiberglass matrix.
Claims20
A method comprising:
- forming a printed circuit board (PCB) comprising:
- coating a second insulating layer on a first insulating layer, the first insulating layer having a first fiberglass content, the first insulating layer on a third insulating layer without an intervening insulating layer between the first insulating layer and the third insulating layer, the third insulating layer including fiberglass, the second insulating layer having a second fiberglass content less than the first fiberglass content and the first insulating layer having a surface roughness that is greater than a surface roughness of the second insulating layer;
- and
- joining a fourth insulating layer over the second insulating layer, the fourth insulating layer including fiberglass.
A method comprising:
- forming a printed circuit board (PCB) comprising:
- coating a first insulating layer on a third insulating layer without an intervening insulating layer between the first insulating layer and the third insulating layer, the third insulating layer including fiberglass;
- and
- coating a second insulating layer on the first insulating layer, the first insulating layer having a first fiberglass content, the second insulating layer having a second fiberglass content less than the first fiberglass content and the first insulating layer having a surface roughness that is greater than a surface roughness of the second insulating laver.
A method comprising:
- forming a printed circuit board (PCB) comprising:
- coating a second insulating layer on a first insulating layer and on a first metal layer, the first insulating layer having a first fiberglass content, the first metal layer being on the first insulating layer, the first insulating layer on a third insulating layer without an intervening insulating layer between the first insulating layer and the third insulating layer, the third insulating layer including fiberglass, the second insulating layer having a second fiberglass content less than the first fiberglass content and the first insulating layer having a surface roughness that is greater than a surface roughness of the second insulating layer;
- and
- after coating the second insulating layer, depositing a second metal layer on the second insulating layer.
Dependencies are inferred from the claim text.