Chip package structure

A chip package structure, comprising:

• a first chip (10) having a plurality of first chip joints (11) at a lower side thereof;
• a circuit board (20) below the first chip;
• an upper side of the circuit board (20) being arranged with a plurality of circuit board joints (21) at positions corresponding to those of the first chip joints of the first chip;
• in packaging, the first chip joints being combined with the circuit board joints of the circuit board so that the first chip is combined to the circuit board by a way of ACF (anisotropic conductive film) combination or convex joint combination;
• and
• wherein in the ACF combination, ACFs are used as welding points to be combined to pads at another end so that the first chip is combined to the circuit board;
• and
• wherein in the convex pad combination, a convex pad is combined with a flat pad by chemically methods or physical methods;
• and these pads are arranged on the circuit board and the first chip;
• and
• wherein the first chip joints (11) are convex pads (112′) protruded from a bottom surface of the first chip (10), the bottom surface is turned upside down so that the convex pads (112′) are at an upper side:
• the circuit board joints (21) are convex pads (212′);
• in packaging, the convex pads (112′) of the first chip (10) are combined to the circuit board joints (21) through conductive wire (150′);
• when there are plurality of first chip joints (11) and circuit board joints (21), the conductive wires (150′) are arranged on a conductor wire arranged substrate (152′), and then the conductor wire arranged substrate (152′) runs across the circuit board joints (21) and the first chip joints (11).