Hierarchical hydrophilic/hydrophobic micro/nanostructures for pushing the limits of critical heat flux
AssigneeUniversity of Florida Research Foundation, Inc.
InventorsSaeed Moghaddam, Seyyed A. Fazeli
Life of this patent
Estimating the term…
Loading patent…
AssigneeUniversity of Florida Research Foundation, Inc.
InventorsSaeed Moghaddam, Seyyed A. Fazeli
Estimating the term…
A high efficiency heat sink for the cooling of microelectronic devices involves a phase change from liquid fluid to fluid vapor with a vapor quality of 100%. The liquid fluid is provided to an active area that contains fins having micrometer dimension that support a membrane that is nanoporous. The membrane is effectively impermeable to liquid fluid but permeable to fluid vapor. The heat sink provides very high heat flux and coefficient of heat transfer at low mass flux over a broad range of surface superheat temperatures. The heat sink can be constructed of equi-spaced posts that separate liquid microchannels from vapor microchannels that are connected through capillary forced valves formed between adjacent equi-spaced posts.
A phase change heat sink, comprising:
A method to cool a microelectronic device, comprising:
A phase change heat sink, comprising:
Dependencies are inferred from the claim text.