Circuit board, package structure and method of manufacturing the same

A circuit board, comprising:

• an interconnect substrate, including a core layer and a conductive structure disposed on the core layer;
• and a multilayer structure, disposed on the conductive structure, wherein the multilayer structure comprises:
• a plurality of dielectric layers;
• and a plurality of circuit structures, disposed in the dielectric layers, a topmost layer in the circuit structures exposed to the dielectric layers, so as to contact with the conductive structure, wherein a pattern of the topmost layer in the circuit structures and a pattern of a top surface of the conductive structure are engaged with each other, wherein the pattern of the topmost layer in the circuit structures are convex patterns when the pattern of the top surface of the conductive structure is a concave pattern, and the pattern of the topmost layer in the circuit structures is a concave pattern when the pattern of the top surface of the conductive structure is a convex pattern.