Method of making single reflow power pin connections

A method, comprising:

• providing a direct bonded copper (DBC) substrate including a ceramic layer and copper traces on a surface of the ceramic layer;
• providing a guide plate having protrusions on a surface of the guide plate;
• mating hollow bush rings with the protrusions, wherein each of said bush rings has an end at which the wall of the bush ring has multiple raised portions and multiple depressed portions, said end located in a plane that is perpendicular to the longitudinal axis of that bush ring;
• mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces;
• attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces;
• and
• after said simultaneous reflow, removing the protrusions from the bush rings.