Back to results
US 10,897,820 B2Granted
Printed wiring board, printed circuit board, and electronic device
AssigneeCanon Kabushiki Kaisha
InventorsKoji Noguchi, Yusuke Hashimoto
Life of this patent
Estimating the term…
Abstract
Provided is a printed wiring board comprising: a substrate; a conductive layer including a land and a wiring and formed on a surface of the substrate, the wiring having a width smaller than the land and drawn from the land; and an insulating layer formed on the conductive layer. The insulating layer has an opening corresponding to a position of the land, and an edge of the opening runs above the land and above one of edges in a width direction of the wiring.
Claims20
A printed wiring board comprising:
- a substrate;
- a conductive layer formed on the substrate, the conductive layer including a first land, a wiring drawn from the first land, and a second land formed at a position closer to an outer edge of the substrate than the first land, the wiring having a first edge formed along a drawing direction of the wiring and a second edge opposed to the first edge;
- and
- an insulating layer formed on the conductive layer, the insulating layer having an opening,
- wherein a distance between the first edge of the wiring and the second edge of the wiring is smaller than a width of the first land,
- wherein the first land includes a first region covered with the insulating layer and a second region not covered with the insulating layer, the first edge of the wiring being connected to the first region of the first land, the second edge of the wiring being connected to the second region of the first land,
- wherein an edge of the opening runs above the first land and above the second edge of the wiring and does not run above the first edge of the wiring, and
- wherein the wiring is drawn toward the outer edge of the substrate and extends to a position closer to the outer edge of the substrate than the second land.
5 more elements
A printed circuit board comprising:
- a substrate;
- a conductive layer formed on the substrate, the conductive layer including a first land, a wiring drawn from the first land, and a second land formed at a position closer to an outer edge of the substrate than the first land, the wiring having a first edge formed along a drawing direction of the wiring and a second edge opposed to the first edge;
- an insulating layer formed on the conductive layer, the insulating layer having an opening;
- and
- an electronic component joined to a part of the first land by solder,
- wherein a distance between the first edge of the wiring and the second edge of the wiring is smaller than a width of the first land,
- wherein the first land includes a first region covered with the insulating layer and a second region not covered with the insulating layer, the first edge of the wiring being connected to the first region of the first land, the second edge of the wiring being connected to the second region of the first land,
- wherein an edge of the opening runs above the first land and above the second edge of the wiring and does not run above the first edge of the wiring,
- wherein the solder is in contact with the second region of the first land and the second edge of the wiring and the solder is not in contact with the first region of the first land and the first edge of the wiring, and
- wherein the wiring is drawn toward the outer edge of the substrate and extends to a position closer to the outer edge of the substrate than the second land.
7 more elements
An electronic device comprising:
- a printed circuit board built in the electronic device,
- wherein the printed circuit board includes:
- a substrate;
- a conductive layer formed on the substrate, the conductive layer including a first land, a wiring drawn from the first land, and a second land formed at a position closer to an outer edge of the substrate than the first land, the wiring having a first edge formed along a drawing direction of the wiring and a second edge opposed to the first edge;
- an insulating layer formed on the conductive layer, the insulating layer having an opening;
- and
- an electronic component joined to a part of the first land by solder,
- wherein a distance between the first edge of the wiring and the second edge of the wiring is smaller than a width of the first land,
- wherein the first land includes a first region covered with the insulating layer and a second region not covered with the insulating layer, the first edge of the wiring being connected to the first region of the first land, the second edge of the wiring being connected to the second region of the first land,
- wherein an edge of the opening runs above the first land and above the second edge of the wiring and does not run above the first edge of the wiring,
- wherein the solder is in contact with the second region of the first land and the second edge of the wiring and the solder is not in contact with the first region of the first land and the first edge of the wiring, and
- wherein the wiring is drawn toward the outer edge of the substrate and extends to a position closer to the outer edge of the substrate than the second land.
9 more elements
Dependencies are inferred from the claim text.