Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board

A metal foil with resin, comprising:

• an uncured insulating layer including a polyphenylene ether compound;
• a metal layer joined with the uncured insulating layer;
• and
• an intermediate layer interposed between the uncured insulating layer and the metal layer, the intermediate layer including a silane compound,
• wherein:
• the metal layer has a junction surface that is joined with the uncured insulating layer via the intermediate layer,
• the junction surface has a ten-point average roughness Rz ranging from 0.5 μm to 4 μm inclusive,
• the entirety of the polyphenylene ether compound included in the uncured insulating layer is a modified polyphenylene ether having a terminal functional group including a carbon-to-carbon unsaturated bond,
• the uncured insulating layer includes a thermosetting resin composition,
• the thermosetting resin composition contains:
• the modified polyphenylene ether and a curing agent including a carbon-to-carbon unsaturated bond,
• a content ratio of the curing agent is from 10 parts by mass to 70 parts by mass relative to 100 parts by mass of a total amount of the modified polyphenylene ether and the curing agent, and
• the modified polyphenylene ether has a weight-average molecular weight ranging from 500 to 3000 inclusive.

A printed wiring board comprising:

• a cured insulating layer including a polyphenylene ether compound;
• a wiring joined with the cured insulating layer;
• and
• an intermediate layer interposed between the cured insulating layer and the wiring, the intermediate layer including a silane compound,
• wherein:
• the wiring has a junction surface that is joined with the cured insulating layer via the intermediate layer,
• the junction surface has a ten-point average roughness Rz ranging from 0.5 μm to 4 μm inclusive,
• the entirety of the polyphenylene ether compound included in the cured insulating layer is a cured product of a modified polyphenylene ether having a terminal functional group including a carbon-to-carbon unsaturated bond,
• the cured insulating layer is a cured product of a thermosetting resin composition,
• the thermosetting resin composition contains:
• the modified polyphenylene ether and a curing agent including a carbon-to-carbon unsaturated bond,
• a content ratio of the curing agent is from 10 parts by mass to 70 parts by mass relative to 100 parts by mass of a total amount of the modified polyphenylene ether and the curing agent, and
• the modified polyphenylene ether has a weight-average molecular weight ranging from 500 to 3000 inclusive.

A method for producing a metal-clad laminate, the method comprising:

• preparing an uncured insulating layer including a polyphenylene ether compound;
• joining a metal layer with the uncured insulating layer;
• and
• curing the uncured insulating layer to form a cured insulating layer,
• wherein:
• an intermediate layer including a silane compound is interposed between the cured insulating layer and the metal layer,
• the metal layer has a junction surface that is joined with the cured insulating layer via the intermediate layer,
• the junction surface has a ten-point average roughness Rz ranging from 0.5 μm to 4 μm inclusive,
• the entirety of the polyphenylene ether compound included in the cured insulating layer is a cured product of a modified polyphenylene ether having a terminal functional group including a carbon-to-carbon unsaturated bond,
• the uncured insulating layer includes a thermosetting resin composition,
• the thermosetting resin composition contains:
• the modified polyphenylene ether and a curing agent including a carbon-to-carbon unsaturated bond,
• a content ratio of the curing agent is from 10 parts by mass to 70 parts by mass relative to 100 parts by mass of a total amount of the modified polyphenylene ether and the curing agent, and
• the modified polyphenylene ether has a weight-average molecular weight ranging from 500 to 3000 inclusive.