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US 10,897,812 B2Granted
Component carrier having a component shielding and method of manufacturing the same
AssigneeAT&S (Chongqing) Company Limited
InventorMinwoo Lee
Life of this patent
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Abstract
A component carrier and a method of manufacturing the same are disclosed. The component carrier has a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a component embedded in the stack. Sidewalls of the component are directly covered with an electrically conductive layer. The component carrier achieves enhanced thermal dissipation and EMI shielding characteristics and has an improved stiffness.
Claims15
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- and
- a component embedded in the stack;
- wherein sidewalk of the component are directly covered with an electrically conductive layer;
- wherein an electrically insulating structure is at least partly applied onto the electrically conductive layer and an electrically conductive structure is at least partly applied on the electrically insulating structure, and a thermally conductive and electrically insulating structure is arranged between the electrically conductive layer and the electrically conductive structure.
2 more elements
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- and
- a component embedded in the stack;
- wherein sidewalk of the component are directly covered with an electrically conductive layer;
- and
- an electrically insulating structure is at least partly applied onto the electrically conductive layer and an electrically conductive structure is at least partly applied on the electrically insulating structure, and a thermally conductive and electrically insulating structure, which is different from the electrically insulating structure, is arranged between the electrically conductive layer and the electrically conductive structure.
3 more elements
Dependencies are inferred from the claim text.