US 10,897,810 B2 · High speed signal fan-out method for BGA and printed circuit board using the same

Abstract

The present invention provides a high speed signal fan-out method for BGA and a PCB using the same. The method comprises: providing a printed circuit board (PCB), providing a plurality of vias and signal traces of the vias on the PCB; and providing back-drilled holes for routing of other signal traces at positions corresponding to the vias. The vias are arranged into a plurality of straight lines from an edge to the center of the PCB. The plurality of straight lines each is horizontal or vertical. The signal traces of the vias in a straight line are arranged from high to low or from low to high with respect to routing positions of the vias, and the back-drilled holes of the plurality of vias are arranged in descending or ascending order corresponding to the depths of the back-drilled holes.

Claims14

Dependent claims

A high speed signal fan-out method for ball grid array (BGA), comprising:

providing a printed circuit board (PCB), providing a plurality of vias and a plurality of signal traces on the PCB;
the plurality of vias include a first via electrically connected to a first signal trace, a second via adjacent to the first via electrically connected to a second signal trace and a third via adjacent to the second via, wherein the first via comprises a first back-drilled hole directly below the first via and the first signal trace, wherein the second signal trace passes through the first back-drilled hole to directly cross over the first back-drilled hole, in a direction away from the third via.

Dependencies are inferred from the claim text.

Facts

Application

16/234,829Filed 28 Dec 2018

Priority

CN 2017 1 1474182629 Dec 2017

Published

US 2019/0208618 A14 Jul 2019

Granted

19 Jan 2021

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

H05K 1/0216
Electrical arrangements not otherwise provided for: reduction of cross-talk, noise or electromagnetic interference
H05K 1/115
Printed elements for providing electric connections to or between printed circuits: via connections; Lands around holes or via connections
H05K 3/0047
Mechanical working of the substrate, e.g. drilling or punching: drilling of holes
H05K 3/043
The conductive material being removed mechanically, e.g. by punching: by using a moving tool for milling or cutting the conductive material

High speed signal fan-out method for BGA and printed circuit board using the same

Life of this patent

High speed signal fan-out method for BGA and printed circuit board using the same

Life of this patent

Abstract

Claims14