Optical apparatus for optical transceivers
AssigneeHewlett Packard Enterprise Development LP
InventorsSagi Varghese Mathai, Michael Renee Ty Tan
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Abstract
An optical apparatus is provided for an optical transceiver. The optical apparatus includes an interposer, a glass lens chip bonded to the interposer, and a plurality of bottom-emitting vertical-cavity surface-emitting lasers (VCSELs) flip chipped to the interposer. Each of the bottom-emitting VCSELs is fabricated on a respective substrate, at least one bottom-emitting VCSEL is capable of emitting an optical signal having a wavelength of about 850 nm, and at least a portion of the respective substrate on which the at least one bottom-emitting VCSEL is fabricated is removed to permit the at least one bottom-emitting VCSEL to emit the optical signal having the wavelength of about 850 nm to the glass lens chip.
Claims15
An optical apparatus for an optical transceiver, comprising:
- an interposer;
- a glass lens chip bonded to the interposer;
- a plurality of bottom-emitting vertical-cavity surface-emitting lasers (VCSELs) flip chipped to the interposer and fabricated on respective substrates, wherein at least one substrate includes a first portion opaque to a wavelength of an optical signal of a bottom-emitting VCSEL fabricated on the at least one substrate, and a second portion transparent to the wavelength of the optical signal of the bottom-emitting VCSEL fabricated on the at least one substrate after removal of the first portion from the at least one substrate, the second portion fabricated as a continuous layer bonded to the bottom-emitting VCSEL, the second portion having upper and lower surfaces extending parallel to each other;
- and
- an etch stop layer disposed between the second portion and a n-doped distributed Bragg reflector.
An optical apparatus for an optical transceiver, comprising:
- a silicon interposer;
- a plurality of bottom-emitting vertical-cavity surface-emitting lasers (VCSELs) flip chipped to the silicon interposer and fabricated on respective substrates, wherein at least one substrate includes a first portion opaque to a wavelength of an optical signal of a first bottom-emitting VCSEL fabricated on the at least one substrate, and a second portion transparent to the wavelength of the optical signal of the first bottom-emitting VCSEL fabricated on the at least one substrate after removal of the first portion from the at least one substrate, the second portion having upper and lower surfaces extending parallel to each other, and wherein at least one second substrate of a second bottom-emitting VCSEL includes a first portion opaque to the wavelength of the optical signal of the first bottom-emitting VCSEL and is not removed from the at least one second substrate;
- an etch stop layer disposed between the second portion and a n-doped distributed Bragg reflector;
- a glass lens chip spaced from the silicon interposer and forming at least one lens to collimate the optical signal;
- a plurality of mechanical standoffs disposed between the silicon interposer and the glass lens chip, the silicon interposer and the glass lens chip defining a gap therebetween in which the plurality of bottom-emitting VCSELs are disposed;
- and
- underfill disposed in at least a portion of the gap.
Dependencies are inferred from the claim text.