Laminated ceramic electronic component and electronic component assembly

A laminated ceramic electronic component having a mounting surface which is to be joined to a mounted member using a conductive member, an opposite surface located opposite to the mounting surface in a lamination direction, a first side surface connecting the mounting surface and the opposite surface, and a second side surface connecting the mounting surface and the opposite surface and located opposite to the first side surface in a length direction, the laminated ceramic electronic component, comprising:

• a first side-surface electrode layer disposed on the first side surface or the second side surface;
• a second side-surface electrode layer disposed on the second side surface;
• a first opposite-surface electrode layer disposed on the opposite surface and connected to the first side-surface electrode layer;
• a second opposite-surface electrode layer disposed on the opposite surface, connected to the second side-surface electrode layer, and separated from the first opposite-surface electrode layer;
• a first mounting-surface electrode layer disposed on the mounting surface and connected to the second side-surface electrode layer;
• a second mounting-surface electrode layer disposed on the mounting surface, connected to the second side-surface electrode layer, and separated from the first mounting-surface electrode layer;
• an opposite-side dielectric ceramic layer being in contact with the first opposite-surface electrode layer and the second opposite-surface electrode layer;
• a mounting-side dielectric ceramic layer being in contact with the first mounting-surface electrode layer and the second mounting-surface electrode layer;
• and
• a mounting-side inner electrode layer separated from the first mounting-surface electrode layer and the second mounting-surface electrode layer by the mounting-side dielectric ceramic layer, disposed on the mounting-side dielectric ceramic layer, extending from the first side-surface electrode layer, and separated from the second side-surface electrode layer, wherein
• in a cross-sectional view including the lamination direction and the length direction, a position in which the second mounting-surface electrode layer has a maximum thickness is shifted toward the second side surface in the length direction with respect to a position in which the second opposite-surface electrode layer has a maximum thickness, wherein
• the laminated ceramic electronic component has a longitudinal surface surrounded by the mounting surface, the opposite surface, the first side surface, and the second side surface, and
• a distance from the longitudinal surface to the mounting-side inner electrode layer is smaller than a thickness of the mounting-side dielectric ceramic layer.

A laminated ceramic electronic component having a mounting surface which is to be joined to mounted member using a conductive member, an opposite surface located opposite to the mounting surface in a lamination direction, a first side surface connecting the mounting surface and the opposite surface, and a second side surface connecting the mounting surface and the opposite surface and located opposite to the first side surface in a length direction the laminated ceramic electronic component, comprising:

• a first side-surface electrode layer disposed on the first side surface or the second side surface;
• a second side-surface electrode layer disposed on the second side surface;
• a first opposite-surface electrode layer disposed on the opposite surface and connected to the first side-surface electrode layer;
• a second opposite-surface electrode layer disposed on the opposite surface, connected to the second side-surface electrode layer, and separated from the first opposite-surface electrode layer:
• a first mounting:
• surface electrode layer disposed on the mounting-surface and connected to the first side-surface electrode layer;
• a second mounting-surface electrode layer disposed on the mounting surface, connected to the second side-surface electrode layer, and separated from the first mounting-surface electrode layer;
• an opposite-side dielectric ceramic layer being in contact with the first opposite-surface electrode layer and the second opposite-surface electrode layer;
• a mounting side dielectric ceramic layer being in contact with the first mounting-surface electrode layer and the second mounting-surface electrode layer;
• and
• a mounting-side inner electrode layer separated from the first mounting-surface electrode layer and the second mounting-surface electrode layer by the mounting-side dielectric ceramic layer, disposed on the mounting-side dielectric ceramic layer, extending from the first side-surface electrode layer, and separated from the second side-surface electrode layer, wherein
• in a cross-sectional view including the lamination direction and the length direction, a position in which the second mounting-surface electrode layer has a maximum, thickness is shifted toward the second side surface in the length direction with respect to a position in which the second opposite-surface electrode layer has a maximum thickness, wherein
• the first side-surface electrode layer is disposed on the second side surface.