Spherical array of optoelectronics for free space optical communication and power delivery, and neuromorphic interconnection

A method for forming a three-dimensional (3D) semiconductor structure, comprising:

• etching a structure having a device layer over a buried oxide (BOX) that, in turn, is over a handling wafer, to create edge undercuts relative to an underside of the BOX, the device layer including fixed-position optoelectronic devices;
• depositing a dielectric onto the structure to cover exposed surfaces of the device layer;
• patterning the dielectric and exposing anchors in the dielectric;
• immersing the structure in a corrosive material to remove the BOX and obtaining a print;
• transferring the print onto a water soluble tape while removing the handling wafer;
• attaching the water soluble tape having the print onto a elastomer that is pre-strained;
• dissolving the water soluble tape to obtain a tape-free resultant structure;
• and
• releasing a strain on the elastomer to compressively unbuckle the tape-free resultant structure and form the 3D semiconductor structure on a relaxed version of the elastomer, the 3D semiconductor structure comprising a spherical array having the fixed-position optoelectronic devices oriented to face and communicate in different directions without motion of the apparatus and the fixed-position optoelectronic devices of the apparatus.