SiC device and methods of manufacturing thereof

A method of manufacturing a semiconductor device, the method comprising:

• forming gate trenches in a SiC substrate and extending lengthwise in parallel in a first direction, wherein a trench interval which defines a space between adjacent ones of the gate trenches extends in a second direction perpendicular to the first direction;
• forming source regions of a first conductivity type in the SiC substrate and occupying a first part of the space between adjacent ones of the gate trenches;
• forming body regions of a second conductivity type opposite the first conductivity type in the SiC substrate below the source regions and occupying a second part of the space between adjacent ones of the gate trenches;
• forming body contact regions of the second conductivity type in the SiC substrate and occupying a third part of the space between adjacent ones of the gate trenches;
• and
• forming shielding regions of the second conductivity type deeper in the SiC substrate than the body regions and adjoining a bottom of at least some of the gate trenches,
• wherein sections of the body regions disposed along sidewalls of the gate trenches form channel regions of the semiconductor device,
• wherein opposing sidewalls of the same gate trench are aligned with the (11-20) a-face of the SiC substrate so that the channel regions extend along the (11-20) a-face.

A semiconductor device, comprising:

• gate trenches formed in a SiC substrate and extending lengthwise in parallel in a first direction, wherein a trench interval which defines a space between adjacent ones of the gate trenches extends in a second direction perpendicular to the first direction;
• source regions of a first conductivity type formed in the SiC substrate and occupying a first part of the space between adjacent ones of the gate trenches;
• body regions of a second conductivity type opposite the first conductivity type formed in the SiC substrate below the source regions and occupying a second part of the space between adjacent ones of the gate trenches;
• body contact regions of the second conductivity type formed in the SiC substrate and occupying a third part of the space between adjacent ones of the gate trenches;
• shielding regions of the second conductivity type formed deeper in the SiC substrate than the body regions and adjoining a bottom of at least some of the gate trenches;
• and
• additional shielding regions of the second conductivity type formed in the SiC substrate and adjoining a sidewall of at least some of the gate trenches,
• wherein the shielding regions are electrically contacted through adjoining ones of the additional shielding regions and/or adjoining ones of the body contact regions.

A method of manufacturing a semiconductor device, the method comprising:

• forming gate trenches in a SiC substrate and extending lengthwise in parallel in a first direction, wherein a trench interval which defines a space between adjacent ones of the gate trenches extends in a second direction perpendicular to the first direction;
• forming source regions of a first conductivity type in the SiC substrate and occupying a first part of the space between adjacent ones of the gate trenches;
• forming body regions of a second conductivity type opposite the first conductivity type in the SiC substrate below the source regions and occupying a second part of the space between adjacent ones of the gate trenches;
• forming body contact regions of the second conductivity type in the SiC substrate and occupying a third part of the space between adjacent ones of the gate trenches;
• forming shielding regions of the second conductivity type deeper in the SiC substrate than the body regions and adjoining a bottom of at least some of the gate trenches;
• and
• forming additional shielding regions of the second conductivity type in the SiC substrate and adjoining a sidewall of at least some of the gate trenches;
• wherein at least one of the shielding regions, the additional shielding regions and the body contact regions are formed such that the shielding regions are electrically contacted through adjoining ones of the additional shielding regions and/or adjoining ones of the body contact regions.