Micro-LED transfer method, manufacturing method and device

A micro-LED transfer method, comprising:

• obtaining a carrier substrate, wherein the carrier substrate is laser-transparent and has a first surface and a second surface which is opposite to the first surface, and micro-LEDs to be transferred are formed on the second surface;
• forming a protection layer on a third surface of a receiving substrate, wherein the third surface of the receiving substrate is configured to receive the micro-LEDs to be transferred via pads;
• bringing the micro-LEDs to be transferred into contact with the pads on the third surface;
• and
• irradiating the micro-LEDs to be transferred with laser from the first surface to lift-off the micro-LEDs to be transferred from the carrier substrate, wherein the protection layer is configured to protect the third surface from the irradiation of the laser,
• wherein the protection layer is formed on the third surface in a blanket manner without mask patterning and is conductive, and the protection layer covers the pads, and
• wherein the method further comprises:
• removing the protection layer between micro-LEDs on the third surface after lifting-off the micro-LEDs to be transferred.