Method of manufacturing semiconductor device, and mounting device

A method of manufacturing a semiconductor device in which one or more semiconductor chips are laminated and mounted in a plurality of locations on a substrate, comprising:

• a first temporary crimping step and a second temporary crimping step of sequentially laminating the one or more semiconductor chips in each of two or more locations on the substrate while temporarily crimping the one or more semiconductor chips to thereby form chip stacks in a temporarily crimped state;
• and
• a first permanent crimping step and a second permanent crimping step of sequentially heating and pressurizing top surfaces of all of the chip stacks formed in the temporarily crimped state to thereby collectively permanently crimp the one or more semiconductor chips which form each of the chip stacks,
• wherein the method
• performs the first temporary crimping step, the second temporary crimping step, the first permanent crimping step, and the second permanent crimping at least once until a desired number of the chip stacks are reached,
• further comprises a specifying step prior to the first temporary crimping step for specifying a separation distance which is a distance from the chip stacks under permanent crimping to a location at which a temperature of the substrate, the temperature having been raised by heating due to the first permanent crimping, becomes less than or equal to a prescribed permissible temperature,
• in the first temporary crimping step, forms the chip stacks in the temporarily crimped state to be separated from each other by the separation distance or more,
• in the second temporary crimping step, forms the chip stacks in the temporarily crimped state between chip stacks in a permanent crimped state without the separation distance,
• in the first permanent crimping step, permanently crimps the chip stacks which are in the temporarily crimped state and are formed separated from each other by the separation distance or more, and
• in the second permanent crimping step, permanently crimps the chip stacks which are in the temporarily crimped state and are between the chip stacks in the permanent crimped state.