Methods and systems for packaging an integrated circuit
AssigneeMarvell Asia Pte Ltd
InventorsRunzi Chang, Winston Lee
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Abstract
A method for packaging an integrated circuit including a first semiconductor device and a second semiconductor device arranged on a substrate includes calculating parameters of a forming gas based on each of a curing temperature and an estimate of a surface trap density associated with the integrated circuit, dispensing a molding compound over the first semiconductor device, the second semiconductor device, and the substrate, and curing the molding compound in accordance with the curing temperature while flowing the forming gas in accordance with the calculated parameters.
Claims20
A method for packaging an integrated circuit including a first semiconductor device and a second semiconductor device arranged on a substrate, the method comprising:
- calculating parameters of a forming gas based on (i) a curing temperature and (ii) an estimate of a surface trap density associated with the integrated circuit;
- dispensing a molding compound over the first semiconductor device, the second semiconductor device, and the substrate;
- and
- curing the molding compound in accordance with the curing temperature while flowing the forming gas in accordance with the calculated parameters.
A system for packaging an integrated circuit including a first semiconductor device and a second semiconductor device arranged on a substrate, the system comprising:
- a controller configured to calculate parameters of a forming gas based on (i) a curing temperature and (ii) an estimate of a surface trap density associated with the integrated circuit;
- a material introduction port configured to dispense a molding compound over the first semiconductor device, the second semiconductor device, and the substrate;
- a heater responsive configured to cure the molding compound in accordance with the curing temperature;
- and
- a gas port configured to flow the forming gas,
- wherein the controller is further configured to control the heater and the gas port to flow the forming gas in accordance with the calculated parameters while the molding compound is being cured.
Dependencies are inferred from the claim text.