Soldering a conductor to an aluminum metallization
AssigneeInfineon Technologies AG
InventorsEdmund Riedl, Wu Hu Li, Alexander Heinrich, Ralf Otremba, Werner Reiss
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Abstract
A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.
Claims20
A method of soldering a conductor to an aluminum metallization, the method comprising:
- applying a halogenide via a plasma process to an aluminum oxide layer on the aluminum metallization to produce a halogenated aluminum oxide layer;
- disposing a solder material over the halogenated aluminum oxide layer;
- and
- soldering the conductor to the aluminum metallization.
A method of soldering a conductor to an aluminum metallization, the method comprising:
- applying a halogenide via a plasma process to an aluminum oxide layer on the aluminum metallization to produce a halogenated aluminum oxide layer;
- applying a flux material to the halogenated aluminum oxide layer;
- disposing a solder material over the halogenated aluminum oxide layer;
- and
- soldering the conductor to the aluminum metallization.
A method of soldering a conductor to an aluminum metallization, the method comprising:
- applying a halogenide via a plasma process to an aluminum oxide layer on the aluminum metallization to produce a halogenated aluminum oxide layer;
- at least partly reducing the halogenated aluminum oxide layer by applying a reducing gas to the halogenated aluminum oxide layer;
- disposing a solder material over the halogenated aluminum oxide layer;
- and
- soldering the conductor to the aluminum metallization.
Dependencies are inferred from the claim text.