Wire bonding apparatus

A wire bonding method for electrically connecting an electrode and an aluminum alloy wire to each other by wire bonding with heat treatment, pressure treatment and ultrasonic treatment via a wire bonding apparatus, the wire bonding apparatus including

• a wire feeding device which includes a reel on which the aluminum alloy wire is wound, and which feeds the wire from the reel,
• a first wire heater having a through-hole formed therein, the first wire heater having a heater built in an inner wall of the through-hole, a diameter of the through-hole being not less than 500 μm, so as to allow the wire to pass therethrough, the first wire heater heating the wire, as the wire passes through the through-hole of the first wire heater, to a temperature of 50° C. to 100° C., the first wire heater including a temperature sensor measuring the temperature of the wire, provided at an end of the first wire heater and adjacent to where the wire is to bond to the electrode,
• a control device controlling an output of the first wire heater to control the temperature of the wire,
• a pressure device which presses the heated wire that passes through the first wire heater, against the electrode, and
• an ultrasonic wave generating device which generates an ultrasonic vibration and
• applies the ultrasonic vibration to the heated wire that is pressed by the pressure device, the method comprising:
• heating the wire by the first wire heater to a temperature not lower than 50° C. and not higher than 100° C.;
• disposing the wire by placing the wire on the electrode and pressing the wire against the electrode by the pressure device;
• and
• applying an ultrasonic vibration to the wire concurrently with the disposing the wire by the ultrasonic wave generating device, while the temperature of the wire is not lower than 50° C. and not higher than 100° C.,
• wherein the wire has a diameter not less than 500 μm and not greater than 600 μm.