Semiconductor device
AssigneeToshiba Memory Corporation
InventorsYu Suzuki, Shoko Kikuchi, Merii Inaba, Jun Murakami, Takashi Shigeoka, Hiroshi Inagaki, Takashi Okuhata
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Abstract
A semiconductor device includes: a semiconductor substrate; a plurality of first pad electrodes provided above the semiconductor substrate; a plurality of first wires electrically connected to the plurality of first pad electrodes respectively; a first electrode commonly connected to the plurality of first wires; a second pad electrode provided above the semiconductor substrate; and a first resistance portion and a first protective element that are connected in series between the first electrode and the second pad electrode.
Claims20
A semiconductor device comprising:
- a semiconductor substrate;
- a plurality of first pad electrodes provided above the semiconductor substrate;
- a plurality of first wires electrically connected to the plurality of first pad electrodes respectively;
- a first electrode commonly connected to the plurality of first wires;
- a second pad electrode provided above the semiconductor substrate;
- a first resistance portion and a first protective element that are connected in series between the first electrode and the second pad electrode;
- a plurality of second wires electrically connected to the plurality of first pad electrodes respectively;
- a second electrode commonly connected to the plurality of second wires;
- a third pad electrode provided above the semiconductor substrate;
- and
- a second resistance portion and a second protective element that are connected in series between the second electrode and the third pad electrode.
A semiconductor device, comprising:
- a semiconductor substrate;
- a plurality of first pad electrodes provided above the semiconductor substrate;
- a plurality of first wires electrically connected to the plurality of first pad electrodes respectively;
- a first electrode commonly connected to the plurality of first wires;
- a second pad electrode provided above the semiconductor substrate;
- and
- a first resistance portion and a first protective element that are connected in series between the first electrode and the second pad electrode, wherein
- the first resistance portion comprises:
- a first portion connected to the first electrode;
- a second portion connected to the first portion;
- and
- a third portion connected to the second portion, and
- a wiring width of the second portion is smaller than wiring widths of each of the first portion and the third portion.
Dependencies are inferred from the claim text.