Multi-access memory system and a method to manufacture the system
AssigneeAltera Corporation
InventorHui Liu
Life of this patent
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Abstract
A multiple memory access system is disclosed. The system includes a first die disposed on a package substrate. A second die is stacked above the first die. The first die, the second die and the package substrate form a first package. An IC is placed within a close proximity of the first package where the first die communicates with the second die at a first data rate while the first die communicates with the IC at a second data rate. The first data rate is higher than the second data rate. Methods of forming a multi-access memory system are also disclosed.
Claims15
A method for forming a multi-access memory system comprising a first package that includes a first die, a second die, and a package substrate, the method comprising:
- forming first and second pads on a surface of the first die;
- forming electrical surface routings that are disposed only along the surface of the first die, wherein each of the electrical surface routings is the only electrical connection between one of the first pads and one of the second pads;
- placing the first die on the package substrate;
- stacking the second die on the first die, wherein the first die is operable to communicate with the second die via the first pads, the electrical surface routings, the second pads, and a plurality of bumps or balls each physically contacting the second die and one of the second pads, and wherein the second die is of smaller size than the first die;
- and
- interconnecting the first die to the package substrate.
Dependencies are inferred from the claim text.