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US 10,896,886 B2Granted
Semiconductor devices having discretely located passivation material, and associated systems and methods
AssigneeMicron Technology, Inc.
InventorsMayukhee Das, Jonathan S. Hacker, Christopher J. Gambee, Chandra S. Tiwari
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Abstract
Semiconductor devices having discretely located passivation material are disclosed herein. In one embodiment, a semiconductor device assembly can include a bond pad having a bonding surface with a process artifact. A passivation material can be positioned to at least partially fill a portion of the process artifact. A conductive structure can be positioned to extend across the bonding surface of the bond pad.
Claims27
A semiconductor device assembly, comprising:
- a semiconductor die including—
- a bond pad having a bonding surface, wherein the bonding surface includes an asymmetrical surface irregularity;
- and
- a passivation material at least partially filling a portion of the surface irregularity;
- and
- a conductive structure extending across the bonding surface of the bond pad.
3 more elements
A semiconductor device assembly, comprising:
- a die having a bonding element, a passivation material, and one or more conductive materials, wherein the bonding element includes a bonding surface having an asymmetrical surface irregularity extending across a portion of the bonding surface, wherein the passivation material is contained within the portion of the bonding surface, and wherein the one or more conductive materials extend across the bonding surface.
A method of forming a semiconductor device assembly, comprising
- forming a passivation material on the bond pad of a semiconductor die, wherein the bond pad includes an asymmetrical surface irregularity, wherein the passivation material overlies the bond pad and at least partially fills the surface irregularity;
- etching away at least some of the passivation material not overlying the surface irregularity;
- and
- forming a conductive structure that extends across the bond pad and covers the surface irregularity.
1 more element
Dependencies are inferred from the claim text.