Electronic package having heat dissipating element and method for fabricating the same
AssigneePhoenix Aktiengesellschaft
InventorsShih-Ping Hsu, Che-Wei Hsu, Chih-Kuai Yang
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Abstract
An electronic package and a method for fabricating the same are provided. The method includes bonding a portion of an inactive surface of an electronic component to a thermal conductive layer of a heat dissipating element, encapsulating the electronic component and the thermal conductive layer with an encapsulant, and forming a circuit structure on the encapsulant and electrically connecting the circuit structure to the electronic component. Since the heat dissipating element is bonded to the electronic component through the thermal conductive layer, the heat dissipating effect of the electronic package is improved.
Claims18
An electronic package, comprising:
- a heat dissipating element having a surface with a thermal conductive layer, wherein the thermal conductive layer is in direct contact with a portion of the surface and is free from being formed on the entire surface, and wherein the thermal conductive layer has a non-continuous pattern;
- an electronic component disposed on the heat dissipating element, wherein the electronic component has an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface, and the thermal conductive layer is in direct contact with a portion of the inactive surface and is free from being formed on the entire inactive surface, such that the thermal conductive layer is positioned in one portion of a space formed between the inactive surface of the electronic component and the surface of the heat dissipating element and comes into contact with the heat dissipating element and the electronic component;
- an encapsulant formed on the heat dissipating element and filled in another portion of the space formed between the inactive surface of the electronic component and the surface of the heat dissipating element and without the thermal conductive layer to encapsulate the electronic component, wherein the heat dissipating has another surface free from being covered with the encapsulant;
- and
- a circuit structure formed on the encapsulant and electrically connected to the electrode pads of the electronic component.
A method for fabricating an electronic package, comprising:
- disposing an electronic component on a heat dissipating element having a surface with a thermal conductive layer, wherein the thermal conductive layer is in direct contact with a portion of the surface and is free from being formed on the entire surface, wherein the thermal conductive layer has a non-continuous pattern, and wherein the electronic component has an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface, and the thermal conductive layer is in direct contact with a portion of the inactive surface and is free from being formed on the entire inactive surface, such that the thermal conductive layer is positioned in one portion of a space formed between the inactive surface of the electronic component and the surface of the heat dissipating element and comes into contact with the heat dissipating element and the electronic component;
- forming an encapsulant on the heat dissipating element and filling the encapsulant in another portion of the space formed between the inactive surface of the electronic component and the surface of the heat dissipating element and without the thermal conductive layer to encapsulate the electronic component, wherein the heat dissipating has another surface free from being covered with the encapsulant;
- and
- forming a circuit structure on the encapsulant and electrically connecting the circuit structure to the electrode pads of the electronic component.
Dependencies are inferred from the claim text.