Semiconductor package having reflective layer with selective transmittance
AssigneeSamsung Electronics Co., Ltd.
InventorsKun Sil Lee, Dong Kwan Kim, Bo Ram Kang, Ho Geon Song, Won Keun Kim
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Abstract
A semiconductor package includes a semiconductor package substrate. An insulating layer is disposed on the semiconductor package substrate. A semiconductor chip is disposed on the semiconductor package substrate and is covered by the insulating layer. A reflective layer is disposed on the insulating layer and is spaced apart from the semiconductor chip. The reflective layer is configured to selectively transmit radiation through to the insulating layer. A protective layer is disposed on the reflective layer.
Claims16
A semiconductor package, comprising:
- a semiconductor package substrate;
- an insulating layer disposed on the semiconductor package substrate;
- a semiconductor chip disposed on the semiconductor package substrate and covered by the insulating layer;
- a reflective layer disposed on the insulating layer and spaced apart from the semiconductor chip, the reflective layer configured to selectively transmit soft X-rays and hard X-rays through to the insulating layer to protect the semiconductor chip from the soft X-rays;
- and
- a protective layer disposed on the reflective layer.
A semiconductor package, comprising:
- a semiconductor package substrate;
- a molding layer disposed on the semiconductor package substrate;
- and
- a semiconductor chip disposed on the semiconductor package substrate and covered by the molding layer,
- wherein the semiconductor package is configured to be more transmissive of hard X-rays than soft X-rays to protect the semiconductor chip from the soft X-rays,
- wherein the molding layer comprises:
- an insulating layer disposed on an upper surface of the semiconductor package substrate and including the semiconductor chip therein;
- a reflective layer disposed on the insulating layer and spaced apart from the semiconductor chip;
- and
- a protective layer disposed on the reflective layer, and
- wherein the reflective layer is configured to block soft X-rays, and transmit hard X-rays into the insulating layer.
A semiconductor package, comprising:
- a semiconductor package substrate;
- an insulating layer disposed on the semiconductor package substrate;
- a semiconductor chip disposed on the semiconductor package substrate and covered by the insulating layer;
- a reflective layer disposed on the insulating layer and spaced apart from the semiconductor chip and including a metal material having an atomic number greater than 12 to protect the semiconductor chip from soft X-rays;
- and
- a protective layer disposed on the reflective layer.
Dependencies are inferred from the claim text.