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US 10,896,877 B1Granted
System in package with double side mounted board
AssigneeFlex Ltd.
InventorsCheng Yang, Dongkai Shangguan, Bo Li, Venkat Iyer
Life of this patent
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Abstract
An improved SiP structure includes one or more interposers positioned to form a center cavity into which one or more electronic components can be mounted. The improved SiP structure provides a reduced footprint using the one or more interposers and formed center cavity without the need of laser drilling, exposed molding, and/or double side molding.
Claims11
A system in package structure comprising:
- a. a first substrate comprising a first surface of the first substrate and a second surface of the first substrate opposing the first surface of the first substrate;
- b. a first electronic component mechanically and electrically coupled to the first surface of the first substrate;
- c. a second substrate comprising a first surface of the second substrate and a second surface of the second substrate opposing the first surface of the second substrate;
- d. one or more interposers positioned between and mechanically and electrically coupled to the first substrate and the second substrate, wherein the one or more interposers form a central cavity between the one or more interposers, the second surface of the first substrate, and the first surface of the second substrate;
- e. a second electronic component positioned within the center cavity, wherein the second electronic component is mechanically and electrically coupled to either the first substrate or the second substrate;
- and
- f. a single side molding layer applied to the first surface of the second substrate, wherein the single side molding layer encapsulates the first substrate, the first electronic component, the one or more interposers, and the second electronic component.
4 more elements
Dependencies are inferred from the claim text.