Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications

A system, comprising:

• a printed circuit board;
• a processor assembly including:
• an interposer disposed on a substrate;
• an integrated circuit directly disposed on the interposer;
• a memory circuit directly disposed on the interposer and coupled to the integrated circuit;
• and
• a capacitor at least partially embedded in the interposer, the capacitor including:
• at least a first non-planar conductor structure and a second non-planar conductor structure separated by a non-planar dielectric structure;
• a first capacitor terminal electrically coupling the first non-planar conductor structure to a first voltage terminal in the integrated circuit;
• a second capacitor terminal electrically coupling the second non-planar conductor structure to a second voltage terminal in the integrated circuit;
• and
• an oxide layer electrically isolating the capacitor from the interposer;
• and
• a power converter disposed on the printed circuit board, the power converter including:
• a first power converter terminal electrically connected to the first capacitor terminal via a first power supply line in the printed circuit board;
• and
• a second power converter terminal electrically connected to the second capacitor terminal via a second power supply line in the printed circuit board.