US 10,896,872 B2Granted

Connecting structure and circuit

AssigneeNEC Corporation

InventorsAyako Uemura, Kazuhiro Kashiwakura

Life of this patent

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Abstract

The present invention addresses the problem of providing a connecting structure or similar that can minimize a decrease in a wireable region of a substrate while reducing the effect of stubs of a pair of vias on the output of a capacitor that is connected to said vias. In order to solve this problem, this connecting structure comprises: a first conductor that passes through a substrate and is provided with a first input/output section; a second conductor that passes through the substrate and is provided with a second input/output section; a first capacitor, one terminal of which being connected to a terminal of the first conductor that is on a first surface of the substrate, the other terminal of which being connected to a terminal of the second conductor that is on the first surface of the substrate; and a second capacitor or a resistor.

Claims14

Dependent claims

A connecting structure, including:

a first conductor that passes through a substrate and includes a first input/output section;
a second conductor that passes through the substrate and includes a second input/output section;
a first capacitor, one terminal of which being connected to a terminal of the first conductor that is on a first surface of the substrate, the other terminal of which being connected to a terminal of the second conductor that is on the first surface of the substrate;
and
a second capacitor or a resistor, one terminal of which being connected to a terminal of the first conductor that is on a second surface of the substrate, another terminal of which that is not connected to the one terminal being connected to a terminal of the second conductor that is on the second surface, wherein
the first input/output section is provided to a portion of a side section of the first conductor, and/or the second input/output section is provided to a portion of a side section of the second conductor.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/335,019Filed 15 Sep 2017
Priority: JP 2016-18393421 Sep 2016
Published: US 2019/0252310 A115 Aug 2019
Granted: 19 Jan 2021
Term ends: Not estimatedThe source records don’t support an estimate.

Classification16 codes

H05K 1/0251
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance: related to vias or transitions between vias and transmission lines
H10W 20/496
Capacitive arrangements or effects of, or between wiring layers: capacitor integral with wiring layers
H05K 1/114
Directly combined with via connections: pad being close to via, but not surrounding the via
H05K 1/181
Structurally associated with non-printed electric components: associated with surface mounted components