Electronic device and connector
AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorsSoichiro Umeda, Yuji Morinaga
Life of this patent
Estimating the term…
Abstract
An electronic device has a sealing part 90, an electronic element 95 provided in the sealing part 90, a first terminal that projects outward from the sealing part 90 and a connector 51 that has a head part 40 connected to a front surface of the electronic element 95 via a conductive adhesive 75, and a proximal end part 45 connected to the first terminal via a conductor layer 75. The head part 40 has a single first projection part 41 that projects toward the electronic element 95. The first projection part 41 sinks into the conductive adhesive 75 and comes into point contact with the front surface of the electronic element 95. The proximal end part 45 has a plurality of protrusion parts 49 or a support surface 46, contacting the conductor layer 70.
Claims7
An electronic device comprising:
- a substrate;
- a first conductor layer and a second conductor layer provided on the substrate;
- an electronic element provided on the second conductor layer;
- a first terminal connected to the first conductor layer;
- a connector that electrically connects a front surface of the electronic element and the first conductor layer;
- a sealing part that seals the first conductor layer, the second conductor layer, the electronic element and the connector inside, wherein
- the connector has a head part connected to the front surface of the electronic element via a conductive adhesive and a proximal end part connected to the first conductor layer via a conductive adhesive,
- the head part has a protrusion part protruding toward a side of an electronic element from a facing surface facing the front surface of the electronic element, and a first projection part protruding from the protrusion part toward the side of the electronic element,
- in a state where the first projection part comes into point contact with the front surface of the electronic element, and the conductive adhesive is bonded to the protrusion part and is bonded to the facing surface of the head part around the protrusion part, the head part is connected to the front surface of the electronic element,
- the proximal end part has a plurality of second projection parts protruding from a facing surface facing the first conductor layer to a side of the first conductor layer, and
- the proximal end part is connected to the first conductor layer in a state where the plurality of the second projection parts are in contact with the first conductor layer and the conductive adhesive is bonded to the facing surface of the proximal end part.
A connector in an electronic device having a substrate, a first conductor layer and a second conductor layer provided on the substrate, an electronic element provided on the second conductor layer, a first terminal connected to the first conductor layer, and a sealing part that seals the first conductor layer, the second conductor layer and the electronic element inside, the connector, provided in the sealing part and electrically connecting a front surface of the electronic element and the first conductor layer, comprising:
- a head part connected to the front surface of the electronic element via a conductive adhesive and a proximal end part connected to the first conductor layer via a conductive adhesive;
- the head part has a protrusion part protruding toward a side of an electronic element from a facing surface facing the front surface of the electronic element, and a first projection part protruding from the protrusion part toward the side of the electronic element;
- in a state where the first projection part comes into point contact with the front surface of the electronic element, and the conductive adhesive is bonded to the protrusion part and is bonded to the facing surface of the head part around the protrusion part, the head part is connected to the front surface of the electronic element;
- the proximal end part has a plurality of second projection parts protruding from a facing surface facing the first conductor layer to a side of the first conductor layer;
- and
- the proximal end part is connected to the first conductor layer in a state where the plurality of the second projection parts are in contact with the first conductor layer and the conductive adhesive is bonded to the facing surface of the proximal end part.
Dependencies are inferred from the claim text.