Terminal plate and semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsEitaro Miyake, Kazuya Kodani, Hiroshi Matsuyama, Tatsuya Hirakawa
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsEitaro Miyake, Kazuya Kodani, Hiroshi Matsuyama, Tatsuya Hirakawa
Estimating the term…
Provided is a terminal plate according to an embodiment including: a first plate portion for being connected to a first semiconductor element; a second plate portion for being connected to a second semiconductor element; a third plate portion provided above the first plate portion and the second plate portion; a first connecting portion provided between the first plate portion and the third plate portion and connecting the first plate portion and the third plate portion; a second connecting portion provided between the second plate portion and the third plate portion and connecting the second plate portion and the third plate portion; a fourth plate portion provided above the first plate portion and the second plate portion and provided on the opposite side of the third plate portion with interposing the first and second plate portions; a third connecting portion provided between the first plate portion and the fourth plate portion and connecting the first plate portion and the fourth plate portion; a fourth connecting portion provided between the second plate portion and the fourth plate portion and connecting the second plate portion and the fourth plate portion; and a fifth plate portion provided above the fourth plate portion, the fifth plate portion connected to the fourth plate portion, and the fifth plate portion having a hole.
A semiconductor device comprising:
Dependencies are inferred from the claim text.