Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold

An inverter apparatus comprising a semiconductor device and a circuit substrate on which the semiconductor device is mounted,

• the semiconductor device comprising:
• a first metal pattern;
• a second metal pattern;
• a third metal pattern;
• a first transistor element disposed on or over the first metal pattern;
• a second transistor element disposed on or over the first metal pattern;
• a first upper surface plate electrode electrically connected to the first transistor element and the second transistor element;
• a first wire connected between a control electrode of the first transistor element and the second metal pattern;
• a second wire connected between a control electrode of the second transistor element and the third metal pattern;
• a first rectangular parallelepiped electrode formed to connect between the first transistor element and the first upper surface plate electrode;
• a second rectangular parallelepiped electrode formed to connect between the second transistor element and the first upper surface plate electrode;
• a resin layer formed to cover the first transistor element and the second transistor element, the resin layer having an upper main surface, a lower main surface, and peripheral edges joining the upper main surface and the lower main surface;
• a signal control terminal electrically connected to the first transistor element and the second transistor element;
• and
• a terminal receiving substrate configured to receive the signal control terminal,
• wherein
• a plurality of the semiconductor devices is mounted on the circuit substrate and the semiconductor devices are disposed to be adjacent to one another, and
• the plurality of the semiconductor devices are mounted on the circuit substrate in a manner that a plurality of the signal control terminals respectively extending from the semiconductor devices penetrate the circuit substrate and are received by the terminal receiving substrate.