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US 10,896,865 B2Granted
Power electronics modules including an integrated cooling channel extending through an electrically-conductive substrate
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsShailesh N. Joshi, Naoya Take, Ercan Mehmet Dede, Yanghe Liu
Life of this patent
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Abstract
A power electronics module includes a power electronics device, and an electrically-conductive substrate directly coupled to the power electronics device, the electrically-conductive substrate defining a plurality of channels extending through the electrically-conductive substrate, and a plurality of electrical pathways extending through the electrically-conductive substrate around the plurality of channels.
Claims15
A power electronics module comprising:
- a power electronics device;
- and
- an electrically-conductive substrate directly contacting the power electronics device, wherein the electrically-conductive substrate defines a collector electrode electrically coupled to the power electronics device, the electrically-conductive substrate defining:
- a plurality of channels extending through the electrically-conductive substrate;
- and
- a plurality of electrical pathways extending through the electrically-conductive substrate around the plurality of channels.
3 more elements
A power electronics module comprising:
- an electrically-conductive substrate defining:
- an upper substrate surface facing upward in a vertical direction;
- a lower substrate surface positioned opposite the upper substrate surface and facing downward in the vertical direction;
- an inlet face positioned between the upper substrate surface and the lower substrate surface in the vertical direction;
- an outlet face positioned opposite the inlet face and positioned between the upper substrate surface and the lower substrate surface in the vertical direction;
- a plurality of channels extending through the electrically-conductive substrate between the inlet face and the outlet face;
- and
- a power electronics device coupled to the upper substrate surface and electrically coupled to the lower substrate surface of the electrically-conductive substrate through the upper substrate surface, wherein the electrically-conductive substrate directly contacts the power electronics device.
5 more elements
Dependencies are inferred from the claim text.